Process for preparing an assembly of an article and a polymide which resists dimensional change, delamination and debonding when exposed to changes in temperature

U.S. Patent Number: 5376209

Abstract: An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl.sub.3, DyCl.sub.3, ErCl.sub.3, TmCl.sub.3, Al(C.sub.5 H.sub.7 O.sub.2).sub.3, and Er.sub.2 S.sub.3. The polyamic acid solution was imidized and is combined with the article to form the assembly.

Inventors: Stoakley; Diane M. (Poquoson, VA), St. Clair; Anne K. (Poquoson, VA)

Assignee: The United States of America as represented by the Administrator of the (Washington, DC)

Application Number: 08/141,430

Issued: 1994-12-27

Expired: 2006-12-27

Classes: 156/330.9 ; 156/60; 427/207.1; 427/430.1; 427/99.4

Field of search: 427/96,207.1,430.1 156/60,331.6,330.9

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