Integrated circuit package with stabilizer bar

U.S. Patent Number: 5380952

Abstract: A stabilizer bar made of non-conductive material (such as a poly enid plastic) is secured to the top side of extended leads on each side of a flat high density integrated circuit package. The bar is located intermediate the length of the leads, and is used as a lead form during a subsequent forming operation. The leads are formed around the stabilizer bar, which remains in place throughout the forming operation and during subsequent mounting of the integrated circuit package.

Inventors: Levy; Paul S. (Chandler, AZ)

Assignee: VLSI Technology, Inc. (San Jose, CA)

Application Number: 08/157,963

Issued: 1995-01-10

Expired: 2007-01-10

Classes: 174/556 ; 257/E23.049; 29/827

Field of search: 174/52.1,52.4 437/206,207,209,211,215,217,219,220 29/846,854,855,856,884,827

Click the image above to view patent images at uspto.gov within a frame.

Click here for the fulltext page on uspto.gov within a frame.