Diamond substrates having metallized vias

U.S. Patent Number: 5382758

Abstract: A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond substrates having metallized vias are also disclosed. The structures are useful for making multichip modules for high clock rate computers.

Inventors: Iacovangelo; Charles D. (Schenectady, NY), Jerabek; Elihu C. (Glenmont, NY), Wilson; Ronald H. (Schenectady, NY), Schaefer; Peter C. (Saratoga Springs, NY)

Assignee: General Electric Company (Schenectady, NY)

Application Number: 08/188,877

Issued: 1995-01-17

Expired: 2007-01-17

Classes: 174/262 ; 174/255; 174/257; 174/264; 257/507; 257/E23.005

Field of search: 174/255,256,257,262,264,265,266 361/752 257/507

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