Semiconductor chip mounting method and apparatus

U.S. Patent Number: 5384000

Abstract: The three-dimensional shape of the surface of a board (12) is measured, and the parallel degree between the board (12) and a semiconductor chip (10) is adjusted on the basis of the measurement result. A board mounting means (13) and a semiconductor chip holding means (11) are moved close to each other, and the semiconductor chip (10) is mounted on the board (12).

Inventors: Nishiguchi; Masanori (Yokohama, JP)

Assignee: Sumitomo Electric Industries, Ltd. (Osaka, JP)

Application Number: 08/205,416

Issued: 1995-01-24

Expired: 2007-01-24

Classes: 156/297 ; 156/360; 257/E21.511; 356/388; 356/390; 356/395; 356/398; 356/399

Field of search: 156/297,360 437/7,8,209 356/388,390,395,398,399

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