Printed circuit board having U-shaped solder mask layer separating respective contacts

U.S. Patent Number: 5386087

Abstract: A circuit pattern layer is formed over the surface of a laminated board such that it includes one array of solder pads. The circuit pattern layer has its surface covered with a solder mask layer. The solder mask layer has a U-shaped recess at the area of the solder pad. The solder pad is exposed at the area of the U-shaped recess. Upon the soldering of the connector's connection terminal to the solder pad at the area of the U-shaped recess, a molten solder is kept in the U-shaped recess and prevented from flowing onto the adjacent connection terminal. It is thus possible to prevent a solder bridge from being created across those connection terminals.

Inventors: Lee; Chen W. (Chung-li, TW), Chang; Fong P. (Chung-li, TW), Chen; Chou L. (Chung-li, TW)

Assignee: E. I. Du Pont de Nemours and Company (Wilmington, DE)

Application Number: 08/017,921

Issued: 1995-01-31

Expired: 2007-01-31

Classes: 174/261 ; 174/250; 361/767

Field of search: 174/255,261,260,250 361/767,772,774

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