Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same

U.S. Patent Number: 5387493

Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Inventors: Imabayashi; Shinichiro (Yokohama, JP), Oka; Hitoshi (Yokohama, JP), Tanaka; Isamu (Yokosuka, JP), Kikuchi; Hiroshi (Zushi, JP), Watanabe; Makio (Fujisawa, JP)

Assignee: Hitachi, Ltd. (Tokyo, JP)

Application Number: 07/599,428

Issued: 1995-02-07

Expired: 2007-02-07

Classes: 430/280.1 ; 430/270.1; 430/271.1; 430/281.1; 430/286.1; 430/287.1

Field of search: 430/280,281,286,287,270,271

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