Apparatus and method for thermally coupling a heat sink to a lead frame

U.S. Patent Number: 5387554

Abstract: A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. One or more holes are formed in the lead frame and are engaged by corresponding studs on the heat sink. The stud has a shoulder portion which engages the lead frame to prevent the stud from further passing through the hole in the lead frame.

Inventors: Liang; Louis H. (Los Altos, CA)

Assignee: VLSI Technology, Inc. (San Jose, CA)

Application Number: 08/097,243

Issued: 1995-02-07

Expired: 2007-02-07

Classes: 29/827 ; 257/E23.051; 257/E23.092; 438/122

Field of search: 437/209,217,215,214,220 257/707,706,709,712

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