Hybrid integrated circuit device

U.S. Patent Number: 5387816

Abstract: A pedestal 11 is attached to a circuit substrate 1 having a component placement area 4 when clamping portions 12 and 12 of the pedestal 11 clamp both side portions 5 and 5 of the component placement area 4. It is possible to stand the hybrid integrated circuit device on a parent circuit substrate a by itself before the hybrid integrated circuit device is soldered to the parent circuit substrate a. Since the bottom surfaces of the clamping portions 12 and 12 are flat. The circuit substrates 1, 1, . . . do not overlap one another when the hybrid integrated circuit devices are accommodated in and arranged vertically in a stick since the thickness of the clamping portions 12 and 12 of the pedestal 11 is thicker than the circuit substrate 1. Accordingly, the hybrid integrated circuit device is liable to vertically stand on the parent circuit substrate a by itself and it is easily accommodated in and taken out from the stick.

Inventors: Takahashi; Mitsuo (Aichi, JP), Yagura; Toshiaki (Aichi, JP), Yamada; Kyozo (Tokyo, JP)

Assignee: Nippondenso Co., Ltd. (Kariya, JP) Taiyo Yuden Co., Ltd. (Tokyo, JP)

Application Number: 08/046,100

Issued: 1995-02-07

Expired: 2007-02-07

Classes: 257/723 ; 257/726; 257/E25.029; 361/785

Field of search: 257/723,725,692,726 361/785

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