Electronic circuit assembly with improved heatsinking

U.S. Patent Number: 5388027

Abstract: An electronic circuit assembly with improved heatsinking is provided. The assembly includes a component carrying board (56) which has an opening (62) through it. The opening is sized to receive a heat generating electronic component (64). A diamond layer (50) is attached as a heat sink to the bottom (58) of the component carrying board. The heat generating component (64) is attached directly to the diamond layer (50), through the opening (62) in the component carrying board (56). The diamond layer provides electrical insulation as well as superior heat dissipation.

Inventors: Pollock; Randy L. (Austin, TX), Anderson, Jr.; George F. (Cave Creek, AZ)

Assignee: Motorola, Inc. (Schaumburg, IL)

Application Number: 08/099,670

Issued: 1995-02-07

Expired: 2007-02-07

Classes: 361/705 ; 165/185; 257/711; 257/E23.111; 361/713; 361/762

Field of search: 428/209,614,901 174/16.3,252 257/706,707,711,714 165/80.3,185 361/704,705,707,708,713,718,719,761,762,764

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