Magnetron sputtering apparatus

U.S. Patent Number: 5393398

Abstract: A magnetron sputtering apparatus comprises: a wafer holder for holding a wafer thereon; a target holder for holding a target thereon, disposed opposite to the wafer holder; and a particle interceptor for intercepting some of particles ejected from the target, disposed between the wafer holder and the target holder. The diameter of the target is not less than that of the wafer and not greater than a value 1.4 times that of the wafer. Most particles fall on the surface of the wafer at small incidence angles and only few particles impinge and accumulate on the particle interceptor, so that particles deposit in a film of a uniform thickness over the surface of the wafer and are able to fall on the bottom surfaces of contact holes formed in the wafer. In a modification, the particle interceptor is moved in a plane parallel to the surface of the wafer to distribute particles uniformly over the surface of the wafer.

Inventors: Sugano; Yukiyasu (Kanagawa, JP)

Assignee: Sony Corporation (JP)

Application Number: 08/180,789

Issued: 1995-02-28

Expired: 2007-02-28

Classes: 204/298.11 ; 204/192.12; 204/298.12

Field of search: 204/192.12,192.3,298.06,298.11,298.19,298.12

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