Polycide bonding pad structure

U.S. Patent Number: 5734200

Abstract: A bonding pad adapted for use with an Aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon layer, a refractory metal layer, and a thick Aluminum alloy bonding pad.

Inventors: Hsue; Chen-Chiu (Hsin-Chu, TW); Chien; Sun-Chieh (Hsin-Chu, TW)

Assignee: United Microelectronics Corporation (Taipei, TW)

Application Number: 08/790,336

Issued: 1998-03-31

Expired: 2006-03-31

Classes: 257/755 ; 257/751; 257/754; 257/756; 257/757; 257/768; 257/770; 257/E23.02

Field of search: 257/751,754-758,768,769,770

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