Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith

U.S. Patent Number: 5739187

Abstract: An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.

Inventors: Asano; Eiichi (Usui-gun, JP); Aoki; Takayuki (Usui-gun, JP); Shiobara; Toshio (Usui-gun, JP); Flury; Peter (Himmelried, CH); Scharf; Wolfgang (Grenzach-Wyhlen, DE); Okada; Tadashi (Oberwil, CH)

Assignee: Shin-Etsu Chemical Co., Ltd. (Tokyo, JP) Ciba-Geigy Corporation (Tarrytown, NY)

Application Number: 08/615,145

Issued: 1998-04-14

Expired: 2006-04-14

Classes: 523/451 ; 257/E23.119; 523/400; 523/401; 525/523; 525/538; 528/89; 528/99

Field of search: 523/400,401,451 525/523,538 528/89,99

Click the image above to view patent images at uspto.gov within a frame.

Click here for the fulltext page on uspto.gov within a frame.