Metallized silicon nitride ceramic and fabricating process thereof as well as metallizing composite for the process

U.S. Patent Number: 6447923

Abstract: A highly reliable metallized Si.sub.3 N.sub.4 ceramic having a metallizing layer of high bonding strength on the surface of a highly heat-conductive, mechanically-strong Si.sub.3 N.sub.4 ceramic. A metallizing layer including 0.01 to 20% silicon by weight in terms of silicon is formed on the surface of a silicon nitride ceramic including 0.01 to 10% free silicon by weight and having a thermal conductivity of 50 W/mK or more and a bending strength of 600 MPa or more. The silicon component in the metallizing layer is either introduced from the silicon nitride ceramic by diffusion or included in a metallizing paste beforehand.

Inventors: Yamakawa; Akira (Itami, JP)

Assignee: Sumitomo Electric Industries, Ltd. (Osaka, JP)

Application Number: 09/143,611

Issued: 2002-09-10

Expired: 2006-09-10

Classes: 428/450 ; 427/372.2; 427/383.1; 427/383.5; 428/469; 428/697; 428/698

Field of search: 428/698,472,450,697 106/1.05,1.25,1.26 252/512,514,515,518.1 427/372.2,383.1,383.5

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