Apparatus for holding and delayering a semiconductor die

U.S. Patent Number: 6485361

Abstract: A method and apparatus for holding and delayering a die include an outer member (10) that receives an inner member (20), and a set screw (25) and set screw hole (12) for securing the position of the inner member (20) within the outer member (10). A die (50) is attached to the inner member (20), and the apparatus is then used to apply the die (50) to an abrasive disk (200) which is attached to a rotatable wheel (300) and is delayered by progressive abrading. The outer member (10) provides stability and precision to the delayering operation. The inner member (20) provides portability and control to the delayering operation.

Inventors: Mahanpour; Mehrdad (Union City, CA)

Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA)

Application Number: 08/993,647

Issued: 2002-11-26

Expired: 2006-11-26

Classes: 451/364 ; 451/390; 451/391

Field of search: 451/364,390,391

Click the image above to view patent images at uspto.gov within a frame.

Click here for the fulltext page on uspto.gov within a frame.