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Expired patents of:
Advanced Micro Devices, Inc.

Displaying 1 to 50 of 502 patents. (Retrieval took 3.382 seconds.)

 Patent TitleExpired:
1.Method and apparatus for detecting ion implant induced defects2007-02-25
2.System for tracking quartzware utilization in semiconductor fabrication2007-02-18
3.Instruction alignment unit employing dual instruction queues for high frequency instruction dispatch2007-02-16
4.Automatic decapsulation system utilizing an integrated spacer/protection plate2007-02-11
5.Circuit construction in back side of die and over a buried insulator2007-02-11
6.Design for a simulation module using an object-oriented programming language2007-02-09
7.Concentration measurement apparatus calibration method2007-02-02
8.Parallel and series-coupled transistors having gate conductors formed on sidewall surfaces of a sacrificial structure2007-02-02
9.Automated monitoring of ESD (electro static discharge) of each of a plurality of operators in a production area2007-01-28
10.Method and apparatus for precoining BGA type packages prior to electrical characterization2007-01-21
11.BGA funnel2007-01-17
12.Position-selective and material-selective silicon etching to form measurement structures for semiconductor fabrication2007-01-14
13.Automated prevention of transfer of an unsoaked IC package from a temperature soaking chamber to a testing chamber2007-01-14
14.Tray for shipping PCMCIA cards2007-01-12
15.Teos seaming scribe line monitor2007-01-07
16.Test fixture for future integration2006-12-31
17.Structure and method of semiconductor via testing2006-12-24
18.Cordless vacuum wand2006-12-20
19.Sample preparation for inspection of ball contacts and internal vias2006-12-17
20.Tray with flippable cover2006-12-15
21.Method and circuit for measuring charge dump of an individual transistor in an SOI device2006-12-10
22.PC audio system with frequency compensated wavetable data2006-12-08
23.Photolithography test structure2006-12-06
24.Boat for organic and ceramic flip chip package assembly2006-12-03
25.Semiconductor package extractor and method2006-12-01
26.Decapping machine for packaged integrated circuits2006-11-29
27.Integrated digital processing apparatus having a single biodirectional data bus for accommodating a plurality of peripheral devices connected to a plurality of external buses2006-11-29
28.Apparatus for holding and delayering a semiconductor die2006-11-26
29.Ultra-low level standard for concentration measurements2006-11-24
30.Conductive layer with anti-reflective surface portion2006-11-24
31.System for detecting motherboard operation to ensure compatibility of a microprocessor to be coupled thereto2006-11-24
32.Temperature control unit and sight glass2006-11-19
33.Quadrant avalanche photodiode time-resolved detection2006-11-19
34.Apparatus and method to uniquely identify similarly connected electrical devices2006-11-17
35.Stable local interconnect/active area silicide structure for VLSI applications2006-11-15
36.Fixed guide for singulator arm of semiconductor handler2006-11-12
37.ESD protection continuous monitoring device2006-11-10
38.Dual phase-locked-loop having forced mid range fine control zero at handover2006-11-08
39.Particle removing vacuum system for assembly of FBGA packages2006-11-05
40.Universal carrier tray2006-11-05
41.Chest of counting grids for indicating a count of IC packages for a plurality of types of IC package trays2006-11-05
42.Method for measuring source and drain junction depth in silicon on insulator technology2006-11-05
43.Method for determining coplanarity of electrical contact of BGA type packages prior to electrical characterization2006-11-05
44.MOSFET test structure for capacitance-voltage measurements2006-10-29
45.Determination of effective oxide thickness of a plurality of dielectric materials in a MOS stack2006-10-29
46.Nanomachining of integrated circuits2006-10-29
47.Method and apparatus for testing semiconductor packages without damage2006-10-29
48.Method and system for adapting burn-in boards to multiple burn-in systems2006-10-29
49.Overlay radius offset shift engine2006-10-22
50.Method for modifying a C4 semiconductor device2006-10-22

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