Expired patents of Applied Materials, Inc., page 1

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Expired patents of:
Applied Materials, Inc.

Displaying 1 to 50 of 284 patents. (Retrieval took 2.485 seconds.)

	Patent Title	Expired:
1.	Wafer positioning device with storage capability	2007-02-25
2.	Method of processing a wafer within a reaction chamber	2007-02-23
3.	Bromine and iodine etch process for silicon and silicides	2007-02-23
4.	Micro-enviroment load lock	2007-02-21
5.	Apparatus and methods for ion implantation	2007-02-14
6.	Self positioning vacuum chuck	2007-02-11
7.	Method and apparatus for managing scheduling in a multiple cluster tool	2007-02-11
8.	Pressure actuated sealing diaphragm for chucks	2007-02-09
9.	Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub. 2	2007-02-07
10.	Dynamic gas flow controller	2007-02-02
11.	Film deposition method and apparatus for semiconductor devices	2007-01-28
12.	Method for forming aluminum lines over aluminum-filled vias in a semiconductor substrate	2007-01-21
13.	Process for simultaneous removal of photoresist and polysilicon/polycide etch residues from an integrated circuit structure	2007-01-17
14.	Sputtering apparatus with magnetron device	2007-01-14
15.	Multiple loadlock system	2007-01-14
16.	Process for forming improved titanium-containing barrier layers	2007-01-12
17.	Controlled environment enclosure and mechanical interface	2007-01-03
18.	Barrier layers and aluminum contacts	2007-01-03
19.	Ultrasonic wave assisted contact hole filling	2006-12-22
20.	Method for forming aluminum contacts	2006-12-22
21.	Particulate-free epitaxial process	2006-12-20
22.	Three chamber load lock apparatus	2006-12-17
23.	Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool	2006-12-17
24.	Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer	2006-12-08
25.	Magnetic confinement in a plasma reactor having an RF bias electrode	2006-12-03
26.	Copper etch using HCl and HBR chemistry	2006-12-03
27.	Method and apparatus for etch passivating and etching a substrate	2006-12-03
28.	Energy dissipating coupling	2006-11-26
29.	Cover layer for a substrate support chuck and method of fabricating same	2006-11-24
30.	Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing	2006-11-22
31.	High temperature susceptor	2006-11-17
32.	Self cleaning collimator	2006-11-08
33.	Magnetically enhanced inductively coupled plasma reactor with magnetically confined plasma	2006-10-29
34.	High etch rate method for plasma etching silicon nitride	2006-10-29
35.	Pulsed RF power delivery for plasma processing	2006-10-29
36.	Method and apparatus for improving the conformality of sputter deposited films	2006-10-27
37.	Method and apparatus for improved substrate handling	2006-10-22
38.	Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer	2006-10-18
39.	Substrate support member	2006-10-15
40.	Substrate support member for a processing chamber	2006-10-15
41.	Etching MoSi.sub.2 using SF.sub.6, HBr and O.sub.2	2006-10-11
42.	Independent linear dual-blade robot and method for transferring wafers	2006-09-22
43.	Plasma-inert cover and plasma cleaning process and apparatus employing same	2006-09-22
44.	Multiple loadlock system	2006-09-17
45.	Structure for reducing junction spiking through a wall surface of an overetched contact via	2006-09-10
46.	Detecting a process endpoint from a change in reflectivity	2006-09-10
47.	Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme	2006-09-10
48.	Method for processing substrates using gaseous silicon scavenger	2006-09-03
49.	Plasma reactor with heated source of a polymer-hardening precursor material	2006-08-27
50.	Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures	2006-08-27

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