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Expired patents of:
United Microelectronics Corp.

Displaying 151 to 200 of 464 patents. (Retrieval took 2.251 seconds.)

 Patent TitleExpired:
151.Fabrication method for a two-bit flash memory cell2005-10-16
152.Method of fabricating salicide in electrostatic discharge protection device2005-10-16
153.Method for manufacturing capacitor2005-10-16
154.Method of forming low leakage current borderless contact2005-10-16
155.Method for manufacturing trench isolation2005-10-16
156.Method of manufacturing dummy pattern2005-10-16
157.Method of fabricating a contact window2005-10-16
158.Method of predicting the curvature radius of the microlens2005-10-16
159.Method of fabricating node contact opening2005-10-09
160.EPROM, flash memory with high coupling ratio2005-10-07
161.Equipment for brushing the underside of a semiconductor wafer2005-10-02
162.Method of forming a MOS transistor2005-10-02
163.Method of preventing neck oxidation of a storage node2005-10-02
164.Method of forming a contact hole in a semiconductor wafer2005-10-02
165.Dual damascene interconnect structure with reduced parasitic capacitance2005-10-02
166.Method for fabricating an electrostatic discharge protection circuit2005-09-30
167.Method of forming bit lines having lower conductivity in their respective edges2005-09-30
168.Process for fabricating capacitor cells in dynamic random access memory (DRAM) chips2005-09-30
169.High density flash memory cell2005-09-25
170.Method for forming different types of MOS transistors on a semiconductor wafer2005-09-18
171.Fabrication method of a gate junction conductive structure2005-09-18
172.Method of fabricating gate structure to reduce stress production2005-09-18
173.Method of fabricating self-aligned polysilicon via plug2005-09-18
174.Method of fabricating a semiconductive device2005-09-18
175.Electrically erasable and programmable read only memory device and manufacturing therefor2005-09-18
176.Process for creating high density integrated circuits utilizing double coating photoresist mask2005-09-16
177.Process for fabricating multi-level read-only memory device2005-09-16
178.Method of fabricating high density flat cell mask ROM2005-09-16
179.Process for fabricating tantalum nitride diffusion barrier for copper matallization2005-09-16
180.Wafer holder2005-09-11
181.Read-only-memory process with self-aligned coding2005-09-09
182.Method for fabricating trench/stacked capacitors on DRAM cells with increased capacitance2005-09-09
183.Stress relaxation in dielectric before metalization2005-09-09
184.Method of minimizing defect sources inside high density plasma reactor2005-09-04
185.Structure for laterally diffused metal-oxide semiconductor2005-09-04
186.Fet device with double spacer2005-09-02
187.Method for manufacturing trench isolation2005-08-28
188.Method for forming deep trench capacitor under a shallow trench isolation structure2005-08-28
189.Method for forming an inter-layer dielectric layer2005-08-28
190.Method of forming borderless contact2005-08-28
191.Monitor method for testing probe pins2005-08-28
192.Method for forming bipolar ROM device2005-08-26
193.Stress relaxation in dielectric before metallization2005-08-26
194.Method of bonding an aluminum wire to an intergrated circuit bond pad2005-08-26
195.Mask ROM process with self-aligned ROM code implant2005-08-26
196.Method of fabricating high voltage MOS device2005-08-21
197.Method for forming a metal-oxide-semiconductor transistor2005-08-21
198.Fabrication method for a buried bit line2005-08-21
199.Method for fabricating an interconnect2005-08-21
200.Method of monitoring deep ultraviolet exposure system2005-08-21

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